Multi-Wavelength Optical Transceivers Integrated on Node (MOTION)

We report on efforts to develop a high speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.

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Bibliographic Details
Published in2019 Optical Fiber Communications Conference and Exhibition (OFC) pp. 1 - 3
Main Authors Kuchta, Daniel, Proesel, Jonathan, Doany, Fuad, Lee, Wooram, Dickson, Timothy, Ainspan, Herschel, Meghelli, Mounir, Pepeljugoski, Petar, Gu, Xiaoxiong, Beakes, Michael, Schultz, Mark, Taubenblatt, Marc, Fortier, Paul, Dufort, Catherine, Turcotte, Eric, Pion, Marc-Olivier, Bureau, Charles, Flens, Frank, Light, Greta, Trekell, Blake, Koski, Kevin
Format Conference Proceeding
LanguageEnglish
Published OSA 01.01.2019
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Summary:We report on efforts to develop a high speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.
DOI:10.1364/ofc.2019.m4d.6