Threshold Stress for Crack-Healing of Si3N4/SiC and Resultant Cyclic Fatigue Strength at the Healing Temperature

Si3N4/SiC composite ceramics were hot‐pressed in order to investigate the crack‐healing behavior under stress. Semi‐elliptical surface cracks of 100 μm in surface length were made on each specimen. The pre‐cracked specimens were crack‐healed under cyclic or constant bending stress, and the resultant...

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Bibliographic Details
Published inJournal of the American Ceramic Society Vol. 88; no. 3; pp. 645 - 651
Main Authors Takahashi, Koji, Ando, Kotoji, Murase, Hisashi, Nakayama, Shin, Saito, Shinji
Format Journal Article
LanguageEnglish
Published Oxford, UK Blackwell Science Inc 01.03.2005
Blackwell
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Summary:Si3N4/SiC composite ceramics were hot‐pressed in order to investigate the crack‐healing behavior under stress. Semi‐elliptical surface cracks of 100 μm in surface length were made on each specimen. The pre‐cracked specimens were crack‐healed under cyclic or constant bending stress, and the resultant bending strength and cyclic fatigue strength were studied. The threshold stress for crack‐healing was investigated at healing temperatures of 1000° and 1200°C. The cyclic fatigue strengths of crack‐healed specimens were also investigated at healing temperatures of 900° and 1000°C. The main conclusions are as follows: (1) The threshold cyclic and constant stresses for crack‐healing, below which pre‐cracked specimens recovered their bending strength, were 300 MPa, which was 75% of the bending strength of the pre‐cracked specimens and (2) the crack‐healed specimens exhibited quite high cyclic fatigue strength at crack‐healing temperatures of 900° and 1000°C.
Bibliography:ArticleID:JACE00106
ark:/67375/WNG-GH878M5Z-R
istex:746DA6F1E538D878731378D1762C3CC42ED8FB4C
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Member, American Ceramic Society.
Supported by Grant‐in‐Aid for scientific research allocated to Japan Society for the Promotion Science (JSPS), Young Scientists Research Category (B) No.14750056 of the term from 2002 to 2003.
D. J. Green—contributing editor
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ISSN:0002-7820
1551-2916
DOI:10.1111/j.1551-2916.2005.00106.x