Significant change in water contact angle of electrospray-synthesized SiO2 films depending on their surface morphology

• Published in: Surface and interface analysis Vol. 45; no. 2; pp. 656 - 660
• Main Authors: Kim, Eun-Kyeong, Kim, Ji-Yeong, Kim, Sang Sub
• Format: Journal Article
• Language: English
• Published: Chichester Blackwell Publishing Ltd 01.02.2013; Wiley; Wiley Subscription Services, Inc
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; electrospray; Exact sciences and technology; hydrophobicity; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Physics; SiO2; Solid-fluid interfaces; Spray coating techniques; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); water contact angle; Wetting; Water; hydrophobicity; Inorganic compounds; Silicon oxides; SiO; Contact angle; Amorphous state; water contact angle; Electrospray; Surface structure
• ISSN: 0142-2421; 1096-9918
• DOI: 10.1002/sia.5112

Amorphous SiO2 films were deposited by means of an electrospray technique. The relation between the water contact angle (WCA) of the deposited SiO2 films and the surface morphology is investigated. The feeding rate of the electrospray process greatly affects the morphology of the synthesized SiO2 films. There is also a significant change in the WCA on the surface of the films: the rougher the surface, the greater the WCA. A model based on the Cassie–Baxter formulation is used to explain the change observed in the WCA on the SiO2 films. Copyright © 2012 John Wiley & Sons, Ltd.