The effect of growth parameters on the Mg acceptor in InxGa1-xN:Mg and AlxGa1-xN:Mg

InxGa1–xN and AlxGa1–xN alloys are used in many optoelectronic applications due to their tunable band gap, but p‐type doping remains a challenge. To better understand the Mg acceptor in nitride alloys, we investigate the effects of In or Al mole fraction, growth temperature and sample thickness on t...

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Bibliographic Details
Published inPhysica status solidi. C Vol. 11; no. 3-4; pp. 594 - 597
Main Authors Zvanut, M. E., Willoughby, W. R., Sunay, U. R., Koleske, D. D., Allerman, A. A., Wang, Ke, Araki, Tsutomu, Nanishi, Yasushi
Format Journal Article
LanguageEnglish
Published Berlin WILEY-VCH Verlag 01.04.2014
WILEY‐VCH Verlag
Wiley Subscription Services, Inc
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Summary:InxGa1–xN and AlxGa1–xN alloys are used in many optoelectronic applications due to their tunable band gap, but p‐type doping remains a challenge. To better understand the Mg acceptor in nitride alloys, we investigate the effects of In or Al mole fraction, growth temperature and sample thickness on the amount of un‐ionized (neutral) Mg using electron paramagnetic resonance (EPR) spectroscopy. The results show that neither temperature nor thickness effects the concentration of the neutral Mg‐related acceptor defects; however, the mole fraction of metal, In or Al, alters the behavior of the dopant. For InxGa1–xN, a broadening of the EPR linewidth is shown to be directly related to the presence of a nearby In and is consistent with a lowering of the acceptor level. Incorporation of Al into GaN, on the other hand, produces a systematic decrease in the concentration of neutral Mg‐related acceptors as the amount of Al increases. Earlier studies indicate that the reduction is caused by incomplete hydrogen removal from the acceptor impurity. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Bibliography:istex:9835904E69083BCD4E63ED21848C1689573DC15E
National Science Foundation, DMR-1006163
U.S. Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000
ArticleID:PSSC201300515
ark:/67375/WNG-VMQK2CQR-S
ISSN:1862-6351
1610-1642
DOI:10.1002/pssc.201300515