FOWLP and Si-Interposer for High-Speed Photonic Packaging

A FOWLP and a Si-Interposer integration platform for Electronic IC (EIC) and Photonic IC (PIC) are described here. These two platforms are capable to support high-speed integration and scalable design of the next generation Optical Engine. The integration of the PIC on the FOWLP is achieved by a sim...

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Bibliographic Details
Published in2021 IEEE 71st Electronic Components and Technology Conference (ECTC) pp. 250 - 255
Main Authors Guan, Lim Teck, Ching, Eva Wai Leong, Ching, Jong Ming, Leng, Loh Woon, Wee, David Ho Soon, Bhattacharya, Surya
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.01.2021
Subjects
FOWLP
Integrated circuits
Integrated optics
Optical coupling
Optical design
Optical fibers
Optoelectronic integration
Packaging
Si Interposer
Silicon
Silicon photonics
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Summary:A FOWLP and a Si-Interposer integration platform for Electronic IC (EIC) and Photonic IC (PIC) are described here. These two platforms are capable to support high-speed integration and scalable design of the next generation Optical Engine. The integration of the PIC on the FOWLP is achieved by a simple novel solution. An additional section of the Si substrate is designed at the end of the PIC to protect the optical I/Os during the FOWLP embedding process. For the Through Si-Interposer, besides providing the EIC and PIC, it include the passive alignment feature for the fibre to the PIC assembly.
ISSN:2377-5726
DOI:10.1109/ECTC32696.2021.00050