Determination of Photoresist Degradation Products in O3/DI Processing

Mainly because of cost-saving and environmental concerns, ozone has been introduced as a cleaning agent in semiconductor manufacturing in recent years. This work reports the determination of the most important degradation products formed after the stripping of two different types of photoresist (PR)...

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Bibliographic Details
Published inOzone: science & engineering Vol. 24; no. 5; pp. 391 - 398
Main Authors Vankerckhoven, H., De Smedt, F., Van Herp, B., Claes, M., De Gendt, S., Heyns, M.M., Vinckier, C.
Format Journal Article
LanguageEnglish
Published Philadelphia, PA Taylor & Francis Group 01.01.2002
Taylor & Francis
Subjects
Applied sciences
Carboxylic Acids
Electronics
Exact sciences and technology
Ion Chromatography
Microelectronic fabrication (materials and surfaces technology)
Ozone
Photoresist Removal
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Semiconductor Processing
Ozonization
Microelectronic fabrication
Carboxylic acid
Environment impact
Cleaning
Photolithography
Degradation product
Photoresist
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Summary:Mainly because of cost-saving and environmental concerns, ozone has been introduced as a cleaning agent in semiconductor manufacturing in recent years. This work reports the determination of the most important degradation products formed after the stripping of two different types of photoresist (PR) {1-Line and DUV resist) by ozone processing. Six low molecular weight carboxylic acids could be identified for the I-line PR, five for the DUV PR. The behavior of these degradation products under continuous ozonation as well as their stability in water was also investigated. Despite the chemical similarity of these carboxylic acids, their behavior appears to be quite different.
ISSN:0191-9512
1547-6545
DOI:10.1080/01919510208901629