Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique

We evaluated suitability of AJP (Aerosol Jet Printing) deposited silver layer on variety of organic substrates for the most common interconnect techniques used for electronic packaging. Specifically, we checked if the AJP silver layer can be electrically interconnected by Au and Al wires bonding tec...

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Bibliographic Details
Published in2012 4th Electronic System-Integration Technology Conference pp. 1 - 5
Main Authors Stoukatch, S., Laurent, P., Dricot, S., Axisa, F., Seronveaux, L., Vandormael, D., Beeckman, E., Heusdens, B., Destine, J.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2012
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Summary:We evaluated suitability of AJP (Aerosol Jet Printing) deposited silver layer on variety of organic substrates for the most common interconnect techniques used for electronic packaging. Specifically, we checked if the AJP silver layer can be electrically interconnected by Au and Al wires bonding technique. We also evaluated suitability of AJP silver layer for surface-mount technology (SMT). We performed electrical characterization of the AJP silver layer. We realized a fully functional working prototype of Autonomous Wireless Sensor Node system using AJP silver conductive track as an electrical interconnection.
ISBN:1467346454
9781467346450
DOI:10.1109/ESTC.2012.6542067