Thickness dependence of Weibull slopes of HfO2 gate dielectrics
Breakdown voltage distribution, Weibull slopes, and area scaling factors have been investigated for HfO/sub 2/ gate dielectrics in order to gain a better understanding of the breakdown mechanism. Weibull slope of thick HfO/sub 2/ (e.g., /spl beta//spl ap/4 for EOT=2.5 nm) is smaller than that of SiO...
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Published in | IEEE electron device letters Vol. 24; no. 1; pp. 40 - 42 |
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Main Authors | , , , , , , , |
Format | Journal Article |
Language | English |
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New York
IEEE
01.01.2003
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
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Abstract | Breakdown voltage distribution, Weibull slopes, and area scaling factors have been investigated for HfO/sub 2/ gate dielectrics in order to gain a better understanding of the breakdown mechanism. Weibull slope of thick HfO/sub 2/ (e.g., /spl beta//spl ap/4 for EOT=2.5 nm) is smaller than that of SiO/sub 2/ with similar physical thickness, whereas /spl beta/ of the thinner HfO/sub 2/ (e.g., /spl beta//spl ap/2 for EOT=1.4 nm) is similar to that of SiO/sub 2/. The implication of the thickness dependence of /spl beta/ is discussed. |
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AbstractList | Breakdown voltage distribution, Weibull slopes, and area scaling factors were investigated for HfO2 gate dielectrics in order to gain a better understanding of the breakdown mechanism. A Weibull slope of thick HfO2 (e.g., beta about 4 for EOT = 2.5 nm) is smaller than that of SiO2 with similar physical thickness, whereas beta of the thinner HfO2 (e.g., beta abut 2 for EOT = 1.4 nm) is similar to that of SiO2. The implication of the thickness dependence of beta is discussed. Breakdown voltage distribution, Weibull slopes, and area scaling factors have been investigated for HfO/sub 2/ gate dielectrics in order to gain a better understanding of the breakdown mechanism. Weibull slope of thick HfO/sub 2/ (e.g., /spl beta//spl ap/4 for EOT=2.5 nm) is smaller than that of SiO/sub 2/ with similar physical thickness, whereas /spl beta/ of the thinner HfO/sub 2/ (e.g., /spl beta//spl ap/2 for EOT=1.4 nm) is similar to that of SiO/sub 2/. The implication of the thickness dependence of /spl beta/ is discussed. Breakdown voltage distribution, Weibull slopes, and area scaling factors were investigated for HfO2 gate dielectrics in order to gain a better understanding of the breakdown mechanism. A Weibull slope of thick HfO2 (e.g., beta about 4 for EOT = 2.5 nm) is smaller than that of SiO2 with similar physical thickness, whereas beta of the thinner HfO2 (e.g., beta abut 2 for EOT = 1.4 nm) is similar to that of SiO2. The implication of the thickness dependence of beta is discussed. (Author) |
Author | Young Hee Kim Krishnan, S. Akbar, M.S. Rino Choi Lee, J.C. Hag-Ju Cho Onishi, K. Chang Seok Kang |
Author_xml | – sequence: 1 surname: Young Hee Kim fullname: Young Hee Kim organization: Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA – sequence: 2 givenname: K. surname: Onishi fullname: Onishi, K. organization: Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA – sequence: 3 surname: Chang Seok Kang fullname: Chang Seok Kang organization: Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA – sequence: 4 surname: Hag-Ju Cho fullname: Hag-Ju Cho organization: Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA – sequence: 5 surname: Rino Choi fullname: Rino Choi organization: Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA – sequence: 6 givenname: S. surname: Krishnan fullname: Krishnan, S. organization: Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA – sequence: 7 givenname: M.S. surname: Akbar fullname: Akbar, M.S. organization: Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA – sequence: 8 givenname: J.C. surname: Lee fullname: Lee, J.C. organization: Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA |
BookMark | eNqNz71PwzAQBXALFYm2MDOwRAxsKXf-iJ0JoVIoUqUuRYyRE1_AJU1CnAz89wSViYnppKef3tPN2KRuamLsEmGBCOntZvWw4AB8YUALlCdsikqZGFQiJmwKWmIsEJIzNgthD4BSajlld7t3X3zUFELkqKXaUV1Q1JTRK_l8qKooVE1L4SdZl1sevdmeIuepoqLvfBHO2Wlpq0AXv3fOXh5Xu-U63myfnpf3m9jzhPexy7kEnhpdlppzNCk5QGNLI7UwprSkhZMyBZOTQ56mo7EOrBSFM7zIUczZzbG37ZrPgUKfHXwoqKpsTc0QMm4MR4D0HxCE5kqN8PoP3DdDV49PZOO8MsrIZERXR-SJKGs7f7DdV4ZoFAcpvgGFH26V |
CODEN | EDLEDZ |
ContentType | Journal Article |
Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2003 |
Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2003 |
DBID | RIA RIE 7SP 8FD L7M 7U5 H8D |
DOI | 10.1109/LED.2002.807314 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE/IET Electronic Library (IEL) Electronics & Communications Abstracts Technology Research Database Advanced Technologies Database with Aerospace Solid State and Superconductivity Abstracts Aerospace Database |
DatabaseTitle | Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts Solid State and Superconductivity Abstracts Aerospace Database |
DatabaseTitleList | Technology Research Database Solid State and Superconductivity Abstracts |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Xplore url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 1558-0563 |
EndPage | 42 |
ExternalDocumentID | 2592245361 1185204 |
Genre | orig-research |
GroupedDBID | -~X .DC 0R~ 29I 4.4 5GY 5VS 6IK 97E AAJGR AASAJ ABQJQ ABVLG ACGFO ACIWK ACNCT AENEX AETIX AFFNX AI. AIBXA AKJIK ALLEH ALMA_UNASSIGNED_HOLDINGS ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD HZ~ IBMZZ ICLAB IFIPE IFJZH IPLJI JAVBF LAI M43 O9- OCL P2P RIA RIE RIG RNS TAE TN5 TWZ VH1 XFK 7SP 8FD L7M 7U5 H8D |
ID | FETCH-LOGICAL-i262t-db2402987ff722189ed018af847388fae73d44908bed1299221ad0a43cd82cb13 |
IEDL.DBID | RIE |
ISSN | 0741-3106 |
IngestDate | Fri Aug 16 20:55:01 EDT 2024 Thu Aug 15 23:50:12 EDT 2024 Thu Oct 10 20:32:52 EDT 2024 Wed Jun 26 19:20:26 EDT 2024 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 1 |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-i262t-db2402987ff722189ed018af847388fae73d44908bed1299221ad0a43cd82cb13 |
Notes | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
PQID | 922585846 |
PQPubID | 23500 |
PageCount | 3 |
ParticipantIDs | proquest_miscellaneous_28821009 proquest_miscellaneous_28037255 proquest_journals_922585846 ieee_primary_1185204 |
PublicationCentury | 2000 |
PublicationDate | 2003-Jan. 20030101 |
PublicationDateYYYYMMDD | 2003-01-01 |
PublicationDate_xml | – month: 01 year: 2003 text: 2003-Jan. |
PublicationDecade | 2000 |
PublicationPlace | New York |
PublicationPlace_xml | – name: New York |
PublicationTitle | IEEE electron device letters |
PublicationTitleAbbrev | LED |
PublicationYear | 2003 |
Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
SSID | ssj0014474 |
Score | 1.9028317 |
Snippet | Breakdown voltage distribution, Weibull slopes, and area scaling factors have been investigated for HfO/sub 2/ gate dielectrics in order to gain a better... Breakdown voltage distribution, Weibull slopes, and area scaling factors were investigated for HfO2 gate dielectrics in order to gain a better understanding of... |
SourceID | proquest ieee |
SourceType | Aggregation Database Publisher |
StartPage | 40 |
SubjectTerms | Breakdown voltage Dielectric breakdown Electric breakdown Hafnium oxide High K dielectric materials High-K gate dielectrics Leakage current Lifting equipment MOS capacitors Stress |
Title | Thickness dependence of Weibull slopes of HfO2 gate dielectrics |
URI | https://ieeexplore.ieee.org/document/1185204 https://www.proquest.com/docview/922585846 https://search.proquest.com/docview/28037255 https://search.proquest.com/docview/28821009 |
Volume | 24 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1JT4NAFJ7UnvTgVo21Lhw8Ch1ggJmTMdqmMVYvbeyNzBpJTWmkXPz1vgHaGDXGG8uQWfJ42_cWhK54pKWfJJELqitxiWCRy7mkcBtGAktCDbYJzuOneDQlD7No1kLXm1wYrXUVfKY9e1lh-SqXpXWV9X2b6WuLf25RHNS5WhvEgJC64jJISOArOG7K-PiY9R8H91UsgkeBnm26TtVH5QfzrSTKcA-N12upA0nmXrkSnvz4Vqbxv4vdR7uNaunc1rRwgFp6cYh2vhQc7KCbyWsm55a7Oevut1I7uXFedCbAGHWKt3ypC_tkZJ4Dx_rYHJXVvXIyWRyh6XAwuRu5TQsFNwviYOUqYdETRhNjkgCkOdMK-5QbkEkhpYbrJFTEYn9CK5D8DMZwhTkJpaKBFH54jNqLfKFPkGMhXc5EEhrCCYsFfC6xYSzRQsVYmi7q2ENIl3WVjLTZfxf11secNr9HkcI8YKaA6tNFl5u3QNcWrOALnZdFartmJWDv_DWCgr2K2envE_fQdhV4V7lLzlB79V7qc1AgVuKiopxPuPfC0A |
link.rule.ids | 315,786,790,802,27955,27956,55107 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1JT-MwFH6q4MBwYEd0WJoDR1KcxIntE0IsKtAylyK4RV5FVNSgSXuZXz_PSVqhYYS4ZXHkRS_ve_sDOJWp1RFjaYiiKw2pEmkopeZ4m6SKaMod8QnOo8ds8ETvX9KXDpwtc2GstXXwme37y9qXb0o996ay88hn-vrin6uI84Q12VpLnwGlTc1lxEjkLCRrC_lERJwPb67raIQ-R4r2CTt1J5VP7LfGlNtNGC1W04SSTPrzmerrP_8UavzucrdgoxUug8uGGrahY6c7sP6h5OAuXIxfCz3x_C1Y9L_VNihd8GwLhepoUL2V77byTwbuVxx4K1tgiqZbTqGrPXi6vRlfDcK2iUJYxFk8C43y_hPBmXMsRjwX1pCIS4eolHDupGWJod77p6xB7Bc4RhoiaaINj7WKkn1YmZZTewCBd-pKoVjiqKQiU_i5Jk4IZpXJiHZd2PWHkL83dTLydv9dOFwcc97-IFWO86CigsJPF3rLt0jZ3l0hp7acV7nvm8VQ4_lqBEeNlYif_5-4B2uD8WiYD-8eHw7hRx2GVxtPjmBl9ntuj1GcmKmTmor-AilvxiQ |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Thickness+dependence+of+Weibull+slopes+of+HfO2+gate+dielectrics&rft.jtitle=IEEE+electron+device+letters&rft.au=Kim%2C+Y+H&rft.au=Onishi%2C+K&rft.au=Kang%2C+C+S&rft.au=Cho%2C+H-J&rft.date=2003-01-01&rft.issn=0741-3106&rft.volume=24&rft.issue=1&rft.spage=40&rft.epage=42&rft_id=info:doi/10.1109%2FLED.2002.807314&rft.externalDBID=NO_FULL_TEXT |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0741-3106&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0741-3106&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0741-3106&client=summon |