Integration of III-V on Silicon Gain Devices at the Backside of Silicon-on-Insulator Wafers for Photonic Fully Integrated Circuits

We present a new platform integrating heterogeneous III-V/silicon gain devices at the backside of silicon-on-insulator wafers. The fabrication relies on commercial silicon photonic processes. The performances of lasers and SOAs fabricated accordingly are reported.

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Bibliographic Details
Published in2020 Conference on Lasers and Electro-Optics (CLEO) pp. 1 - 2
Main Authors Menezo, Sylvie, Thiessen, Torrey, Mak, Jason, Fonseca, Jeremy Da, Ribaud, Karen, Yong, Zheng, Jany, Christophe, Poon, Joyce K. S.
Format Conference Proceeding
LanguageEnglish
Published OSA 01.05.2020
Subjects
Distributed feedback devices
Fabrication
Optics
Photonics
Silicon
Silicon-on-insulator
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Summary:We present a new platform integrating heterogeneous III-V/silicon gain devices at the backside of silicon-on-insulator wafers. The fabrication relies on commercial silicon photonic processes. The performances of lasers and SOAs fabricated accordingly are reported.
DOI:10.1364/CLEO_SI.2020.SM4J.7