VACNT-on-silicon platform for improving heat conduction in optoelectronic packaging

Silicon platforms with high-density vertically aligned carbon nanotubes on patterned substrates are designed to provide efficient thermal transfer for optoelectronic chips. 20% increase in output power is obtained when applying for LED packaging.

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Bibliographic Details
Published inCLEO: 2011 - Laser Science to Photonic Applications pp. 1 - 2
Main Authors Chen, Szu-Chieh, Lo, Hsinyi, Hung, Yung, Pan, Yen-Ting, Lee, San-Liang, Ram, Rajeev J.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2011
Subjects
Electronic packaging thermal management
Heating
Light emitting diodes
Silicon
Thermal conductivity
Thermal resistance
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Summary:Silicon platforms with high-density vertically aligned carbon nanotubes on patterned substrates are designed to provide efficient thermal transfer for optoelectronic chips. 20% increase in output power is obtained when applying for LED packaging.
ISBN:1457712237
9781457712234
ISSN:2160-8989
2160-9004