Distortion Minimization for Packaging Level Interconnects

We propose a novel high-speed serial signaling scheme that minimizes the distortion for multichip module (MCM) packaging level communication by intentionally adding leakage resistors between the signal trace and the ground. The new scheme is inspired by the theory of distortionless transmission line...

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Bibliographic Details
Published in2006 IEEE Electrical Performane of Electronic Packaging pp. 175 - 178
Main Authors Haikun Zhu, Rui Shi, Hongyu Chen, Chung-Kuan Cheng, Deutsch, A., Katopis, G.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2006
Subjects
Attenuation
Drives
Electronics packaging
Frequency
Phase distortion
Power transmission lines
Resistors
Skin effect
Stripline
Transmission line theory
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Summary:We propose a novel high-speed serial signaling scheme that minimizes the distortion for multichip module (MCM) packaging level communication by intentionally adding leakage resistors between the signal trace and the ground. The new scheme is inspired by the theory of distortionless transmission line which states that if R/G = L/C, there will be no distortion at the receiver end and the signal propagates at the speed of light. The simulation results indicate that, using the shunt resistor scheme, 10+ Gbps bit rate is achievable over a 10 cm single-ended stripline without pre-emphasis or equalization
ISBN:1424406684
9781424406685
ISSN:2165-4107
DOI:10.1109/EPEP.2006.321221