Cu-In-Microbumps for Low-Temperature Bonding of Fine-Pitch-Interconnects

The advancing heterogeneous integration of various electronic components into a single package requires in particular further development of bonding technologies towards lower temperatures. In our present study, we show the successful joining of dies consisting of Cu-microbumps with In solder caps....

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Bibliographic Details
Published in2017 IEEE 67th Electronic Components and Technology Conference (ECTC) pp. 2092 - 2096
Main Authors Bickel, Steffen, Panchenko, Iuliana, Wahrmund, Wieland, Neumann, Volker, Meyer, Jorg, Wolf, M. Juergen
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2017
Subjects
3D integration
Atmosphere
Bonding
Compounds
Indium
Intermetallic
low-temperture-bonding
Nitrogen
Reliability
SLID
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Summary:The advancing heterogeneous integration of various electronic components into a single package requires in particular further development of bonding technologies towards lower temperatures. In our present study, we show the successful joining of dies consisting of Cu-microbumps with In solder caps. Stable interconnections were achieved at a bonding temperature of 180 °C in 2 min by solid-liquid-interdiffusion (SLID).
ISSN:2377-5726
DOI:10.1109/ECTC.2017.206