Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules

High temperature SiC devices need the materials for device packages also capable of working at higher temperature than those for Si devices. This paper presents a selection of materials that are potentially suitable for use in high temperature package assembly, including die attach, substrate, inter...

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Bibliographic Details
Published in2007 IEEE Power Electronics Specialists Conference pp. 2234 - 2240
Main Authors Coppola, L., Huff, D., Wang, F., Burgos, R., Boroyevich, D.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.01.2007
Subjects
Aerospace materials
Assembly
Automotive materials
Electronics packaging
Encapsulation
Heat sinks
Microassembly
Power electronics
Silicon carbide
Temperature
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ISBN9781424406548
1424406544
ISSN0275-9306
DOI10.1109/PESC.2007.4342356

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Summary:High temperature SiC devices need the materials for device packages also capable of working at higher temperature than those for Si devices. This paper presents a selection of materials that are potentially suitable for use in high temperature package assembly, including die attach, substrate, interconnections, encapsulation, case, heat spreader and heat sink. The temperature under consideration is up to 250degC, corresponding to the need of many applications, including automobiles and aircraft.
ISBN:9781424406548
1424406544
ISSN:0275-9306
DOI:10.1109/PESC.2007.4342356