Plasma dicing technology

Conventional methods for wafer dicing like mechanical or laser dicing solution are showing some limitations. Plasma dicing process was designed to overcome such limitations regarding chip damage and throughput which is discussed in comparison with conventional dicing methods. Typical overall process...

Full description

Saved in:
Bibliographic Details
Published in2012 4th Electronic System-Integration Technology Conference pp. 1 - 5
Main Authors Matsubara, Noriyuki, Windemuth, Reinhard, Mitsuru, Hiroshima, Atsushi, Harikai
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2012
Online AccessGet full text

Cover

Be the first to leave a comment!
You must be logged in first