Plasma dicing technology

Conventional methods for wafer dicing like mechanical or laser dicing solution are showing some limitations. Plasma dicing process was designed to overcome such limitations regarding chip damage and throughput which is discussed in comparison with conventional dicing methods. Typical overall process...

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Bibliographic Details
Published in2012 4th Electronic System-Integration Technology Conference pp. 1 - 5
Main Authors Matsubara, Noriyuki, Windemuth, Reinhard, Mitsuru, Hiroshima, Atsushi, Harikai
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2012
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Summary:Conventional methods for wafer dicing like mechanical or laser dicing solution are showing some limitations. Plasma dicing process was designed to overcome such limitations regarding chip damage and throughput which is discussed in comparison with conventional dicing methods. Typical overall process flow is explained in detail. Some examples of etching results are shown. Solutions for round-corner-etching are explained. We will give better understanding of future solutions for dicing process by use of plasma.
ISBN:1467346454
9781467346450
DOI:10.1109/ESTC.2012.6542178