3D-integrated, low-height, small module design techniques for 4.48GHz, 560MHz-bandwidth TransferJet™ transceiver

A low-height, small module for 4.48GHz carrier frequency, 560MHz bandwidth transceiver has been designed employing 3D integration technology. An LSI integrated with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a small module size of 4.8mm × 4.8m...

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Bibliographic Details
Published in2014 IEEE Radio and Wireless Symposium (RWS) pp. 76 - 78
Main Authors Agawa, Kenichi, Seto, Ichiro, Happoya, Akihiko, Iida, Yoshihiro, Imaizumi, Yusuke, Okano, Motochika, Suzuki, Daigo, Sato, Yuichi, Iwanaga, Masaomi, Sato, Kazumi, Arai, Satoshi, Uchida, Noriaki, Ryugo, Koji, Miyashita, Daisuke, Fujimoto, Ryuichi, Unekawa, Yasuo
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.01.2014
Subjects
3D integration
Band-pass filters
Degradation
high frequency
Impedance matching
Large scale integration
low-height module
Parasitic capacitance
Radio frequency
Transceivers
TransferJet™ transceiver
UWB
wide bandwidth
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Summary:A low-height, small module for 4.48GHz carrier frequency, 560MHz bandwidth transceiver has been designed employing 3D integration technology. An LSI integrated with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a small module size of 4.8mm × 4.8mm × 1.0mm. Since RF signals are degraded by parasitic capacitance associated with the low height and small footprint of the module, three design techniques are proposed in the paper. The module realizes the world's smallest size, and achieves sufficient transmitter modulation accuracy and receiver sensitivity, which meet TransferJet™ standards.
ISSN:2164-2958
2164-2974
DOI:10.1109/RWS.2014.6830099