60-GHz-band transmission module for 3-dimensional system-in-package

• Published in: 2006 8th Electronics Packaging Technology Conference pp. 90 - 95
• Main Authors: Masuda, K., Takeuchi, F., Hamada, Y., Maruhashi, K., Oguma, H., Kameda, S., Nakase, H., Takagi, T., Tsubouchi, K.
• Format: Conference Proceeding
• Language: English
• Published: 01.01.2006
• Subjects: Bandwidth; Bonding; Gain measurement; Integrated circuit technology; Power amplifiers; Power generation; Power measurement; Radio frequency; Radiofrequency amplifiers; Radiofrequency integrated circuits
• ISBN: 9781424406647; 1424406641
• DOI: 10.1109/EPTC.2006.342697

We have proposed an ultra-small and low-cost wireless 3-dimentional system-in-package that includes 60-GHz-band radio frequency (RF) components. 60-GHz-band integrated circuits (ICs) of a 60-GHz-band transmission (TX) module were mounted onto an any layer interstitial via hole (ALIVH) substrate using stud bump bonding (SBB) technology. A mixer using antiparallel diode pair, power amplifier and driver amplifier ICs were fabricated on GaAs substrates. The characteristics of the fabricated TX module in a package were measured. The measured conversion gain and output power at 1-dB gain compression point of the TX module using a single balance mixer were 13 dB and 12 dBm, respectively. The 3-dB bandwidth at lower-side-band (LSB) output was found to be 3 GHz. The measured conversion gain and output power at 1-dB gain compression point of the TX module using a double balance mixer were 11 dB and 10.5 dBm, respectively. The 3-dB bandwidth at LSB output was found to be 3.6 GHz. The measurement results showed sufficient performance for a 60-GHz-band TX module.