Quantitative investigation of pick-up performance for UV-curable dicing tape

It is known that the materials of base film of dicing tapes affects pick-up property, however it is difficult to evaluate pick-up performance quantitatively under die bonding process in manufacturing. In this study, we evaluate dicing tapes with different base film by changing chip thickness and nee...

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Bibliographic Details
Published in2018 IEEE CPMT Symposium Japan (ICSJ) pp. 163 - 166
Main Authors Ogasawara, Takafumi, Saiki, Naoya, Takyu, Shinya
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.11.2018
Subjects
Adhesives
Base film
Dicing tape
Layout
Needles
Pick-up
Position measurement
Real-time systems
Semiconductor device measurement
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Summary:It is known that the materials of base film of dicing tapes affects pick-up property, however it is difficult to evaluate pick-up performance quantitatively under die bonding process in manufacturing. In this study, we evaluate dicing tapes with different base film by changing chip thickness and needle layout in order to clarify the influence of base film on pick-up property. In this study, pick-up property is evaluated quantitatively by measuring load and position of needle and collet in real time using load cell and position sensor. According to the results, it is found that the base film flexibility is more critical for pickup performance in case of that the chip thickness is thin or needle layout is located only at the center of chip.
ISSN:2475-8418
DOI:10.1109/ICSJ.2018.8602645