A Method of Fabricating Bump-Less Interconnects Applicable to Wafer-Scale Flip-Chip Bonding

A chemical flip-chip bonding method by electroless plating process has been developed. This method positively utilizes so-called "bridge" phenomenon between metal pads in electroless Ni-B plating, and enables bump-less interconnect without loading and/or heating at lower temperature (60°C)...

Full description

Saved in:
Bibliographic Details
Published in2008 10th Electronics Packaging Technology Conference pp. 657 - 662
Main Authors Yamaji, Y., Yokoshima, T., Igawa, N., Kikuchi, K., Nakagawa, H., Aoyagi, M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2008
Subjects
Bonding processes
Bridges
Chemical processes
Copper
Electronic equipment testing
Fabrication
Heating
Resins
Vehicles
Wafer bonding
Online AccessGet full text

Cover

More Information
Summary:A chemical flip-chip bonding method by electroless plating process has been developed. This method positively utilizes so-called "bridge" phenomenon between metal pads in electroless Ni-B plating, and enables bump-less interconnect without loading and/or heating at lower temperature (60°C). The interconnect behavior was examined using test chips and substrates with various pad-to-pad configurations. The result confirmed that effective pad width and a ratio of pad pitch to pad width determine the completeness of the interconnection under the condition that distance between facing pads are sufficiently close. A potential of improved method was also demonstrated for fabricating finer pitch flip-chip interconnect with a minimum pad-pitch of 20 ¿m.
ISBN:9781424421176
1424421179
DOI:10.1109/EPTC.2008.4763508