High density vertical interconnects for 3-D integration of silicon integrated circuits

This paper describes a technology platform being developed for three-dimensional (3-D) integration of thin stacked silicon integrated circuits (ICs). 3-D integration technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator array devices h...

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Bibliographic Details
Published in56th Electronic Components and Technology Conference 2006 p. 5 pp.
Main Authors Bower, C.A., Malta, D., Temple, D., Robinson, J.E., Coffinan, P.R., Skokan, M.R., Welch, T.B.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2006
Subjects
Actuators
Array signal processing
Hybrid integrated circuits
Infrared detectors
Infrared sensors
Integrated circuit interconnections
Integrated circuit technology
Sensor arrays
Sensor phenomena and characterization
Silicon
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ISBN1424401526
9781424401529
ISSN0569-5503
DOI10.1109/ECTC.2006.1645677

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Summary:This paper describes a technology platform being developed for three-dimensional (3-D) integration of thin stacked silicon integrated circuits (ICs). 3-D integration technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator array devices hybridized with silicon read-out electronics. Currently, advanced 3-D integrated infrared focal plane array detectors are being developed within the DARPA vertically integrated sensor arrays (VISA) program. Here, we describe the 3-D integration process flow and demonstrations developed in the VISA program
ISBN:1424401526
9781424401529
ISSN:0569-5503
DOI:10.1109/ECTC.2006.1645677