"The latest package and assembly technology for SiC power module"

It is expected to be effective for global environmental conservation and energy saving that power electronics technology introduce to a variety of areas of electric power conversion system, such as electric and hybrid electric vehicle (EV/HEV), IT/CPU power supply, general inverter, electric power g...

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Bibliographic Details
Published in2016 IEEE CPMT Symposium Japan (ICSJ) pp. 1 - 4
Main Authors Takahashi, Yoshikazu, Nogawa, Hiroyuki, Morozumi, Akira, Nishimura, Yoshitaka
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.11.2016
Subjects
Inverters
Multichip modules
Performance evaluation
Silicon
Silicon carbide
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Summary:It is expected to be effective for global environmental conservation and energy saving that power electronics technology introduce to a variety of areas of electric power conversion system, such as electric and hybrid electric vehicle (EV/HEV), IT/CPU power supply, general inverter, electric power grid, and electric train. To meet these trends, the performance of Si power devices have been improving up to their performance limitation derived from material properties of Si. On the other hand, silicon carbide (SiC) power devices have been widely researched and developed because of their superior material properties as power device. This paper presents packaging and assembly technologies for new SiC devices which can improve the performances of power electronics systems.
DOI:10.1109/ICSJ.2016.7801243