Fabrication and Characterization of RF MEMS Package Based on LTCC Lid Substrate and Gold-Tin Eutectic Bonding

This paper reports on an RF MEMS package based on LTCC technology and gold-tin eutectic bonding, and also evaluates physical and RF characteristics of the proposed structure. The package consists of an LTCC lid substrate and a bottom substrate, and assembled by gold-tin layer (80 wt. % gold 20 wt. %...

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Published inTRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference pp. 2115 - 2118
Main Authors Yong-Seung Bang, Jong-Man Kim, Yongsung Kim, Jung-Mu Kim, Yong-Kweon Kim
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.01.2007
Subjects
Assembly
Bonding
Fabrication
Gold
gold-tin
Helium
LTCC
package
Packaging
Radio frequency
Radiofrequency microelectromechanical systems
RF MEMS
Temperature
Tin
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Summary:This paper reports on an RF MEMS package based on LTCC technology and gold-tin eutectic bonding, and also evaluates physical and RF characteristics of the proposed structure. The package consists of an LTCC lid substrate and a bottom substrate, and assembled by gold-tin layer (80 wt. % gold 20 wt. % tin) for hermetic sealing and low temperature bonding. The helium leak rate of 17 packages were 1.38 X 10 -8 atm-cc/sec, and the shear strength of the bonded surface showed in the range of 36 - 50 MPa. The RF characteristics were measured up to 10 GHz, and the packaging loss was calculated to be 0.1349 dB at 2 GHz.
ISBN:9781424408412
1424408415
ISSN:2159-547X
DOI:10.1109/SENSOR.2007.4300583