Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system

The trend towards higher speed and greater integration of modern ICs requires improved cooling technology. This paper describes the design and characterization of a two-phase microchannel heat sink in an electrokinetic VLSI chip cooling system. The heat sink achieves a thermal resistance of 1 K/W fo...

Full description

Saved in:
Bibliographic Details
Published inSeventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) pp. 153 - 157
Main Authors Linan Jiang, Jae-Mo Koo, Shulin Zeng, Mikkelsen, J.C., Lian Zhang, Peng Zhou, Santiago, J.G., Kenny, T.W., Goodson, K.E., Maveety, J.G., Tran, Q.A.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2001
Subjects
Cooling
Electrokinetics
Heat sinks
Microchannel
Resistance heating
Silicon
Testing
Thermal resistance
Very large scale integration
Water heating
Online AccessGet full text

Cover

More Information
Summary:The trend towards higher speed and greater integration of modern ICs requires improved cooling technology. This paper describes the design and characterization of a two-phase microchannel heat sink in an electrokinetic VLSI chip cooling system. The heat sink achieves a thermal resistance of 1 K/W for a 1.2 cm/spl times/1.2 cm silicon thermal test chip under open-loop operation with a water flow-rate of 5 ml/min. Preliminary tests show that a closed-loop EK-pumped system running at 1.2 ml/min and 12 psi removes 17.3 W, with heat rejection at an aluminum fin array. Further optimization of the microchannel dimensions and the working fluid operating pressure are expected to lower the resistance below 0.25 K/W.
ISBN:9780780366497
0780366492
DOI:10.1109/STHERM.2001.915168