New module structure using flip-chip technology for high-speed optical communication ICs

• Published in: 1996 IEEE MTT-S International Microwave Symposium Digest Vol. 1; pp. 243 - 246 vol.1
• Main Authors: Yamaguchi, S., Imai, Y., Kimura, S., Tsunetsugu, H.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1996
• Subjects: Analog integrated circuits; Bonding; High speed optical techniques; Integrated circuit packaging; Laboratories; Nonhomogeneous media; Radio frequency; Radiofrequency integrated circuits; Resonance; Substrates

This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can...