New module structure using flip-chip technology for high-speed optical communication ICs

This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can...

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Bibliographic Details
Published in1996 IEEE MTT-S International Microwave Symposium Digest Vol. 1; pp. 243 - 246 vol.1
Main Authors Yamaguchi, S., Imai, Y., Kimura, S., Tsunetsugu, H.
Format Conference Proceeding
LanguageEnglish
Published IEEE 1996
Subjects
Analog integrated circuits
Bonding
High speed optical techniques
Integrated circuit packaging
Laboratories
Nonhomogeneous media
Radio frequency
Radiofrequency integrated circuits
Resonance
Substrates
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Summary:This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.
ISBN:0780332466
9780780332461
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.1996.508503