Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices

We firstly introduce the compensation of ICs input capacitance effect by using the package bondwire inductance. With the analysis of this effect, we suggested the methodology of finding optimized inductance and demonstrated the improvement in time-domain performance by simulation and measurement.

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Bibliographic Details
Published inElectrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) pp. 159 - 162
Main Authors Seungyoung Ahn, Jongbae Park, Daehyun Chung, Kim, Joungho
Format Conference Proceeding
LanguageEnglish
Published IEEE 2003
Subjects
Bonding
Capacitance
Circuits
Electrostatic discharge
Equations
Frequency
Impedance
Inductance
Insertion loss
Packaging
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Summary:We firstly introduce the compensation of ICs input capacitance effect by using the package bondwire inductance. With the analysis of this effect, we suggested the methodology of finding optimized inductance and demonstrated the improvement in time-domain performance by simulation and measurement.
ISBN:9780780381285
0780381289
DOI:10.1109/EPEP.2003.1250022