An automated process for inclusion of package dies and circuitry within a textile yarn
The integration of small electronic components into textile fabrics, without compromising the textile qualities such as flexibility and conformability, is necessary in ensuring wider adoption of electronic textiles. A solution is to use flexible, electronic yarns that incorporate electronic componen...
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Published in | 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) pp. 1 - 5 |
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Main Authors | , , , , , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.05.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The integration of small electronic components into textile fabrics, without compromising the textile qualities such as flexibility and conformability, is necessary in ensuring wider adoption of electronic textiles. A solution is to use flexible, electronic yarns that incorporate electronic components within the fibers of the yarn. The production of these novel yarns was initially a craft skill, with inclusion of electronics within each section of yarn taking 60 - 90 minutes. A prototype, automated production process was developed to speed up the manufacturing process to 6 minutes. This paper describes the process, using machinery and methods from both electronics and textiles applications. |
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DOI: | 10.1109/DTIP.2018.8394189 |