Mn2O3 Slurry Achieving Reduction of Slurry Waste

• Published in: Jpn J Appl Phys Vol. 51; no. 4; pp. 046506 - 046506-6
• Main Authors: Kishii, Sadahiro, Nakamura, Ko, Hanawa, Kenzo, Watanabe, Satoru, Arimoto, Yoshihiro, Kurokawa, Syuhei, Doi, Toshiro K
• Format: Journal Article
• Language: English
• Published: The Japan Society of Applied Physics 01.04.2012

Fumed silica is widely used for SiO 2 chemical mechanical polishing (CMP). In semiconductor processes, only fresh slurry is used, the used slurry being disposed of. We have demonstrated that Mn 2 O 3 abrasive slurry polishes dielectric SiO 2 film, giving 4 times the removal rate of conventional fume...