III-V photonic integrated circuits for beyond-telecom applications

In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in the InP generic and InP membrane platforms for wireless and sensing applications are reviewed. The realized chips show the great potential of the InP-based...

Full description

Saved in:
Bibliographic Details
Published in2016 25th Wireless and Optical Communication Conference (WOCC) pp. 1 - 5
Main Authors Yuqing Jiao, Longfei Shen, Zizheng Cao, Latkowski, Sylwester, Bente, Erwin, van der Tol, Jos, Ambrosius, Huub, Smit, Meint, Williams, Kevin
Format Conference Proceeding Journal Article
LanguageEnglish
Published IEEE 01.05.2016
Subjects
Conferences
Electronics
Flexibility
generic integration
III-V semiconductor materials
Indium phosphide
indium phosphide (InP)
Indium phosphides
InP membrane on Si (IMOS)
Optical amplifiers
Optical device fabrication
optical sensing
Optical sensors
Photonic integrated circuits (PIC)
Photonics
Platforms
Telecommunications
Wireless communication
Online AccessGet full text

Cover

More Information
Summary:In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in the InP generic and InP membrane platforms for wireless and sensing applications are reviewed. The realized chips show the great potential of the InP-based photonic integration due to its full functionality, high flexibility and high performance.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Conference-1
ObjectType-Feature-3
content type line 23
SourceType-Conference Papers & Proceedings-2
ISSN:2379-1276
DOI:10.1109/WOCC.2016.7506591