Low-cost and TSV-free monolithic 3D-IC with heterogeneous integration of logic, memory and sensor analogy circuitry for Internet of Things

For the first time, a CO2 far-infrared laser annealing (CO2-FIR-LA) technology was developed as the activation solution to enable highly heterogeneous integration without causing device degradation for TSV-free monolithic 3DIC. This process is capable to implement small-area-small-load vertical conn...

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Published in2015 IEEE International Electron Devices Meeting (IEDM) pp. 25.4.1 - 25.4.4
Main Authors Wu, Tsung-Ta, Shen, Chang-Hong, Shieh, Jia-Min, Huang, Wen-Hsien, Wang, Hsing-Hsiang, Hsueh, Fu-Kuo, Chen, Hisu-Chih, Yang, Chih-Chao, Hsieh, Tung-Ying, Chen, Bo-Yuan, Shiao, Yu-Shao, Yang, Chao-Shun, Huang, Guo-Wei, Li, Kai-Shin, Hsueh, Ting-Jen, Chen, Chien-Fu, Chen, Wei-Hao, Yang, Fu-Liang, Chang, Meng-Fan, Yeh, Wen-Kuan
Format Conference Proceeding Journal Article
LanguageEnglish
Published IEEE 01.12.2015
Subjects
Activation
Annealing
Chips
Decoding
Devices
Integrated circuits
Internet
Laser beam annealing
Logic gates
Meetings
Metals
Random access memory
Silicon
Three dimensional
Three-dimensional displays
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Summary:For the first time, a CO2 far-infrared laser annealing (CO2-FIR-LA) technology was developed as the activation solution to enable highly heterogeneous integration without causing device degradation for TSV-free monolithic 3DIC. This process is capable to implement small-area-small-load vertical connectors, gate-first high-k/metal gate MOSFETs and non-Al metal inter-connects. Such a far-infrared laser annealing exhibits excellent selective activation capability that enables performance-enhanced stacked sub-40nm UTB-MOSFETs (Ion-enhanced over 50 %). Unlike TSV-based 3D-IC, this 3D Monolithic IC enables ultra-wide-IO connections between layers to achieve high bandwidth with less power consumption. A test chip with logic circuits, 6T SRAM, ReRAM, sense amplifiers, analog amplifiers and gas sensors was integrated to confirm the superiority in heterogeneous integration of proposed CO2-FIR-LA technology. This chip demonstrates the most variable functions above reported 3D Monolithic ICs. This CO2-FIR-LA based TSV-free 3D Monolithic IC can realize low cost, small footprint, and highly heterogeneous integration for Internet of Things.
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ISSN:2156-017X
DOI:10.1109/IEDM.2015.7409765