Multiphysics modeling for current carrying capability of a power package

In this paper, the impact of the lead frame design on the current carrying capability of the a power package is investigated. The coupled electrical-thermal and mechanical stress simulations are conducted, with the transient characteristics captured. The DoE simulations with regard to different lead...

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Bibliographic Details
Published in2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) pp. 1 - 6
Main Authors Qiuxiao Qian, Yumin Liu, Yong Liu
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.04.2014
Subjects
Abstracts
Cooling
Electromagnetic compatibility
Lead
Solids
Transient analysis
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Summary:In this paper, the impact of the lead frame design on the current carrying capability of the a power package is investigated. The coupled electrical-thermal and mechanical stress simulations are conducted, with the transient characteristics captured. The DoE simulations with regard to different lead frame design, different currents, and micro crack impact are studied to find the impact on current carrying capability. The simulation results show that the twisted Z shape lead design induces the highest stress level when the initial crack was induced by the assembly process, which could speed up the failure and reduce the current carrying capability.
DOI:10.1109/EuroSimE.2014.6813797