A thermal-aware distribution method of TSV in 3D IC

Thermal problem is serious in 3D IC since its high power density. Through Silicon Via (TSV) becomes a main heat dissipation path because of the relatively high thermal conductivity as compared to silicon substrate. To efficiently manage thermal-aware TSV distribution, in this paper an equilateral tr...

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Bibliographic Details
Published in2015 IEEE 11th International Conference on ASIC (ASICON) pp. 1 - 3
Main Authors Ligang Hou, Jingyan Fu, Jinhui Wang, Na Gong, Wei Zhao, Shuqin Geng
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.11.2015
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Summary:Thermal problem is serious in 3D IC since its high power density. Through Silicon Via (TSV) becomes a main heat dissipation path because of the relatively high thermal conductivity as compared to silicon substrate. To efficiently manage thermal-aware TSV distribution, in this paper an equilateral triangle grid distributing method is proposed and is tested on a benchmark. Finite element models are established to study the advantage of this method. It is concluded that under the same condition, the average temperature of equilateral triangle grid distribution is optimized up to 0.9% than square grid distribution in tested model groups.
ISBN:9781479984831
1479984833
ISSN:2162-755X
DOI:10.1109/ASICON.2015.7517067