Miniaturization of a planar EBG structure using interdigital electrodes

• Published in: 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) pp. 39 - 42
• Main Authors: Yamashita, Yuki, Toyota, Yoshitaka, Iokibe, Kengo, Kondo, Koichi, Yoshida, Shigeyoshi, Kaneko, Toshiyuki
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.12.2015
• Subjects: Capacitance; electromagnetic bandgap; interdigital electrode; Metamaterials; Noise reduction; parallel plate resonance; Periodic structures; Ports (Computers); power bus; printed circuit board; Resonant frequency; Wireless communication
• DOI: 10.1109/EDAPS.2015.7383703

This paper describes a proposed planar electromagnetic bandgap (EBG) structure whose unit cell size is miniaturized through the use of interdigital electrodes (IDEs). For planar EBG structures in general, it is difficult to miniaturize the cell size independently of stopband frequency because the stopband frequency depends on the cell size. For the proposed structure, however, the cell size can be miniaturized because the IDEs help enlarge the capacitance between adjacent unit cells and utilize a resonator formed in the unit cells. Because the resonator's resonant frequency determines the stopband frequency of an EBG structure with IDEs, the cell size can be miniaturized independently of the stopband frequency. In the work described in this paper, the proposed EBG structure's efficacy in reducing power bus noise was examined and evaluated through full-wave simulation and measurement in the wireless communication band. It was found that an IDE-EBG structure with a small (25 mm2) unit cell is a valid means for achieving power bus noise reduction.