Fabrication, assembly, failure estimations of for ultra-thin chips stacking by using pre-molding technology

To overcome the severe challenges of achieving an extra-thin thickness down to 10 μm for chip stacking of 3D-IC module such as the mechanical damages appear at chip grinding, subsequent steps of wafer handling, and robust assembly, a novel pre-molding technology applied to assembled stacked module p...

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Bibliographic Details
Published in2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) pp. 237 - 240
Main Authors Chang-Chun Lee, Yu-Min Lin, Yan-Yu Liou, Chau-Jie Zhan, Tao-Chih Chang
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2015
Subjects
Assembly
Packaging
Reliability
Silicon
Stacking
Three-dimensional displays
Through-silicon vias
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Summary:To overcome the severe challenges of achieving an extra-thin thickness down to 10 μm for chip stacking of 3D-IC module such as the mechanical damages appear at chip grinding, subsequent steps of wafer handling, and robust assembly, a novel pre-molding technology applied to assembled stacked module prior to chip thinning procedure is presented in this study. Packaging vehicle is fabricated to demonstrate the feasibility of proposed approach. Moreover, failure estimation and mechanical reliability are also implemented by using a 3D nonlinear finite element analysis.
ISSN:2380-632X
2380-6338
DOI:10.1109/IITC-MAM.2015.7325659