Microfluidic Cooling for Distributed Hot-Spots

2.5D/3D Stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads to a serious heat dissipation challenge. Micro-channels based microfluidic cooling, embedded in the interposer or different layers of 3D IC, targeting at i nserting heat sink into each layer, can con...

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Bibliographic Details
Published in2016 IEEE 66th Electronic Components and Technology Conference (ECTC) pp. 903 - 908
Main Authors Yudan Pi, Wei Wang, Jing Chen, Yufeng Jin
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2016
Subjects
Cooling
distributed hot-spot
Heating
Integrated circuits
microfluidic
Silicon
Temperature measurement
Thermal resistance
thermal spreading
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Summary:2.5D/3D Stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads to a serious heat dissipation challenge. Micro-channels based microfluidic cooling, embedded in the interposer or different layers of 3D IC, targeting at i nserting heat sink into each layer, can considerably shorten the heat transfer path and thereby enhance the heat dissipation. It is worth noting that because of the spreading resistance, even with the same micro-channel structure, the effective thermal dissipation capability shows different on varies hot-spot size. In this paper, a micro-fluidic cooling chip with different-sized hot-spots was fabricated to investigate the influence of h ot-spot characteristics on the cooling ability of the embedded micro-channel. Relationship between temperature and flow rate was experimentally measured as engineering guide in the thermal design of IC with embedded microfluidic cooling.
DOI:10.1109/ECTC.2016.161