Integrating solder bumpers for high shock applications

This paper demonstrates a novel concept for the shock protection of MEMS suspensions: solder is incorporated within the sidewalls of the suspension to produce protective armouring. This provides solder-solder contact at the extremes of the suspension travel, greatly increasing the shock resistance....

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Bibliographic Details
Published in2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) pp. 689 - 692
Main Authors Delahunty, A., Pike, W. T.
Format Conference Proceeding Journal Article
LanguageEnglish
Published IEEE 01.01.2013
Subjects
Acceleration
Armor
Bumpers
Conferences
Contact
Electric shock
Mechanical systems
Micromechanical devices
Plastics
Reactive ion etching
Robustness
Shock resistance
Solders
Springs
Suspensions
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Summary:This paper demonstrates a novel concept for the shock protection of MEMS suspensions: solder is incorporated within the sidewalls of the suspension to produce protective armouring. This provides solder-solder contact at the extremes of the suspension travel, greatly increasing the shock resistance. Model suspension systems were fabricated using deep reactive ion etching (DRIE) and shock tested in a drop-test rig at acceleration levels up to 6000g. The solder armour proved to double the shock resistance of the MEMS suspension.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Conference-1
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SourceType-Conference Papers & Proceedings-2
ISBN:9781467356541
1467356549
ISSN:1084-6999
DOI:10.1109/MEMSYS.2013.6474336