An investigation of sealant materials for display modules subjected to temperature and humidity conditions
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Published in | 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004 pp. 242 - 250 |
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Main Authors | , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
Piscataway NJ
IEEE
2004
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Subjects | |
Online Access | Get full text |
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ISBN: | 9780780387447 0780387449 |
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DOI: | 10.1109/POLYTR.2004.1402769 |