Characterization of Packaging Stress with a Capacitive Stress Sensor Array

This paper presents a high-resolution capacitive stress sensor array to precisely characterize the distributed MEMS packaging stress, for the first time. The unit stress measurement cell utilizes a bridge-type mechanical amplifier that converts the substrate strain into capacitance variations. We ha...

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Bibliographic Details
Published in2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) pp. 909 - 912
Main Authors Veske, Tolga, Erkan, Derin, Tatar, Erdinc
Format Conference Proceeding
LanguageEnglish
Published IEEE 15.01.2023
Subjects
capacitive stress sensor
die-attach
Micromechanical devices
Packaging
Packaging stress
Stress
Substrates
System-on-chip
Temperature measurement
Temperature sensors
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Summary:This paper presents a high-resolution capacitive stress sensor array to precisely characterize the distributed MEMS packaging stress, for the first time. The unit stress measurement cell utilizes a bridge-type mechanical amplifier that converts the substrate strain into capacitance variations. We have measured and compared the MEMS die stress over temperature for different die attaches with a custom designed PCB housing an on-chip heater. The proposed approach significantly simplifies the evaluation and selection of packaging materials. Comparing the temperature responses of a soft silicone-based and stiffer silver-filled epoxy reveals difficult to predict results.
ISSN:2160-1968
DOI:10.1109/MEMS49605.2023.10052529