On Temperature Effects in a MEMS Ring Gyroscope

We report on experimental and analytical investigation of temperature effects in a 3.2mm-diameter, 57kHz ring gyroscope equipped with 16 capacitive stress sensors. According to the well-known ~-60ppm/°C temperature dependency of Young's modulus of silicon, the temperature coefficient of frequen...

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Bibliographic Details
Published in2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) pp. 1 - 4
Main Authors Hosseini-Pishrobat, Mehran, Erkan, Derin, Tatar, Erdinc
Format Conference Proceeding
LanguageEnglish
Published IEEE 25.03.2024
Subjects
Mathematical models
Micromechanical devices
Modeling
Predictive models
Ring gyroscope
Temperature coefficient of frequency
Temperature dependence
Temperature distribution
Temperature measurement
Temperature sensors
Thermal stresses
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Summary:We report on experimental and analytical investigation of temperature effects in a 3.2mm-diameter, 57kHz ring gyroscope equipped with 16 capacitive stress sensors. According to the well-known ~-60ppm/°C temperature dependency of Young's modulus of silicon, the temperature coefficient of frequency (TCF) is expected to be ~-30ppm/°C. Our experimentally observed TCFs, however, tend to be ~-14ppm/°C, pointing to thermal stresses as the countering factor. To find the root cause of the measured TCFs, we develop an analytical framework that enables us to calculate the temperature-induced stiffness variations, considering both thermal and mechanical strains. The model successfully predicts changes and hysteretic behavior of frequency over temperature using the measured stress and temperature data.
ISSN:2377-3480
DOI:10.1109/INERTIAL60399.2024.10502078