Flip Chip Joining with Injection Molded Solder Technology

IBM has developed injection molded solder (IMS) technology in which the molten solder is used to form micro solder bumps. IMS has various technical advantages such as flexibility in the selection of solder alloy compositions, chemical-free soldering process and void-free bumping process. In this pap...

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Bibliographic Details
Published in2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) pp. 1 - 3
Main Authors Hisada, Takashi, Aoki, Toyohiro
Format Conference Proceeding
LanguageEnglish
Published IEEE 07.03.2023
Subjects
Flip-chip devices
injection molded solder
Manufacturing
Metals
Semiconductor device reliability
solder bump
Soldering
Stress
Testing
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Summary:IBM has developed injection molded solder (IMS) technology in which the molten solder is used to form micro solder bumps. IMS has various technical advantages such as flexibility in the selection of solder alloy compositions, chemical-free soldering process and void-free bumping process. In this paper, the basic mechanism of IMS bumping, processes of solder bumping and chip joining and some of the results of reliability stress tests are discussed.
DOI:10.1109/EDTM55494.2023.10103044