Monitoring Product Chip Health with In-die Quality Monitors

This study presents a new type of silicon-embedded chip health monitoring sensors. They extend data collection well beyond typically assessed, to include such important factors as mechanical stress, reliability indicators, and gate to contact proximity. The sensors are part of CV Core® system, and t...

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Bibliographic Details
Published in2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) pp. 1 - 3
Main Authors Brozek, Tomasz, Piadena, Alberto, Quarantelli, Michele, Weiland, Larg, Hess, Christopher, Saxena, Sharad, Yu, Yuan, Vallishayee, Rakesh, Strojwas, Andrzej
Format Conference Proceeding
LanguageEnglish
Published IEEE 03.03.2024
Subjects
Data collection
FinFETs
In-die Sensor
Logic gates
Manufacturing
Mechanical sensors
New Product Introduction (NPI)
Product Quality
Reliability
Sensor phenomena and characterization
Sensor systems
Test
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Summary:This study presents a new type of silicon-embedded chip health monitoring sensors. They extend data collection well beyond typically assessed, to include such important factors as mechanical stress, reliability indicators, and gate to contact proximity. The sensors are part of CV Core® system, and their implementation is demonstrated with examples obtained from 7nm and 12nm FinFET products. The results demonstrate unique capabilities to monitor chip health across the whole life cycle.
DOI:10.1109/EDTM58488.2024.10511552