Invited: Buried Power Rails and Back-side Power Grids: Prospects and Challenges

Buried power rails and back-side power grids are promising technology-scaling boosters for advanced CMOS technology nodes. System-level evaluation of these technologies shows tremendous promise from power-performance-area (PPA), IR drop, and dynamic voltage droop perspective. However, several proces...

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Bibliographic Details
Published in2023 60th ACM/IEEE Design Automation Conference (DAC) pp. 1 - 4
Main Authors Nibhanupudi, S. S. Teja, Oruganti, Sirish, Mathur, Rahul, Gupta, Nishant, Wang, Meizhi, Kulkarni, Jaydeep P.
Format Conference Proceeding
LanguageEnglish
Published IEEE 09.07.2023
Subjects
Buried Power Rails
Design automation
Electric potential
IR drop
Power system dynamics
Process design
Rails
security
technology scaling
Three-dimensional displays
Voltage
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Summary:Buried power rails and back-side power grids are promising technology-scaling boosters for advanced CMOS technology nodes. System-level evaluation of these technologies shows tremendous promise from power-performance-area (PPA), IR drop, and dynamic voltage droop perspective. However, several process, device, and architectural challenges must be addressed to realize the full potential of this technology. This article reviews the advancements and challenges in successfully adopting buried power rail and back-side power grid technology.
DOI:10.1109/DAC56929.2023.10247775