Reliability of Heterogeneous Integration on Hybrid Substrate With Ajinomoto Build-Up Film

The hybrid substrate (build-up package substrate + organic interposer + solder joints + underfill) of 2.3D IC integration (or multiple systems and heterogeneous integration) is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with...

Full description

Saved in:
Bibliographic Details
Published in2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) pp. 542 - 547
Main Authors Yang, Channing Cheng-Lin, Lau, John H, Peng, Andy Yan-Jia, Teng, Vincent, Chen, Gary Chang-Fu, Huang, Jones Yu-Cheng, Chen, YH, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Li, Ming
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2023
Subjects
2.3D IC integration
Ajinomoto build-up film
chip-last
Dielectric materials
Dielectrics
Electronic components
fan-out
hybrid substrate
Integrated circuits
Metals
Multichip modules
organic interposer
Reliability
temporary panel
Online AccessGet full text

Cover

More Information
Summary:The hybrid substrate (build-up package substrate + organic interposer + solder joints + underfill) of 2.3D IC integration (or multiple systems and heterogeneous integration) is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with two different kinds of dielectric materials, namely the PID (photoimageable dielectric) and the ABF (Ajinomoto Build-Up Film). These two hybrid substrates are supporting two chips. The flatness of metal lines of the RDLs (redistribution-layers), the quality of the hybrid substrate after chip-to-hybrid substrate bonding, and the reliability of the solder joints between these two hybrid substrates will be presented.
ISSN:2377-5726
DOI:10.1109/ECTC51909.2023.00097