Thermal and Mechanical characterization of embedded PTCQ packaging test chip die

Heterogeneous integration in electronic packages require special attention on the interfaces between different materials. Embedded components utilize free space in isolating materials to integrate functions directly in the center of a substrate. Due to material differences, mechanical forces might a...

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Bibliographic Details
Published in2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) pp. 537 - 541
Main Authors Weis, Gerald, Schwarz, Timo, Cherman, Vladimir, Stahr, Hannes, Van Der Plas, Geert
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2023
Subjects
chip-package interaction - CPI
Electronic components
Electronic packaging thermal management
embedding of semiconductors
hiding dies
miniaturization
Multichip modules
Optimization
package optimization
Substrates
thermal performance
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Summary:Heterogeneous integration in electronic packages require special attention on the interfaces between different materials. Embedded components utilize free space in isolating materials to integrate functions directly in the center of a substrate. Due to material differences, mechanical forces might apply on the electrical interconnection between the semiconductor and the package. An evaluation of the interface and a comparison to standard components shows that embedding enables further miniaturization and help to outperform traditional packaging technologies for a variety of operating conditions.
ISSN:2377-5726
DOI:10.1109/ECTC51909.2023.00096