Analysis of Differential Stripline Routing Approaches within a PCB Via Field for Crosstalk Mitigation

Signal integrity (SI) in high-speed channels is becoming more critical by the day with increasing data rate of modern computer server systems. Crosstalk generated within the densely packed via/pin field is one of the major sources of SI performance degradation. This work focuses on the tightly pitch...

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Bibliographic Details
Published in2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) pp. 1 - 3
Main Authors Datta, Srijan, Wang, Yuechen, Tang, Junyan, Yang, Xianbo, Zhang, Yanyan, Paladhi, Pavel R., Bohra, Mahesh, Myers, Joshua C., Chun, Sungjun, Dreps, Daniel M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 15.10.2023
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Summary:Signal integrity (SI) in high-speed channels is becoming more critical by the day with increasing data rate of modern computer server systems. Crosstalk generated within the densely packed via/pin field is one of the major sources of SI performance degradation. This work focuses on the tightly pitched striplines within the pin field region of multi-layer printed circuit boards (PCBs) and studies the far-end crosstalk (FEXT) behavior for two frequently adopted routing approaches- "zigzag" and "arc". Electromagnetic modelling and SI analysis are carried out to analyze and quantify the FEXT effect in the two routing configurations with the inclusion of the PCB misregistration effect. Additionally, crosstalk study on the implementation of "tabbed lines" for the two types of pin area wiring is reported. Based on the observed results, routing guidelines are summarized and discussed for improving FEXT within a via filed.
ISSN:2165-4115
DOI:10.1109/EPEPS58208.2023.10314873