Process Control Challenges and Solutions for Advanced Semiconductor Devices

We report on the challenges of process control for advanced semiconductor devices and comprehensive solutions to overcome them. The challenges arise in the environment of 3D structures and process complexity where pitch decreases and aspect ratio increases at advanced technology nodes. In this work...

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Bibliographic Details
Published in2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) pp. 1 - 3
Main Authors Jee, Yun Jung, Han, Sang Hyun, Wolfling, Shay
Format Conference Proceeding
LanguageEnglish
Published IEEE 07.03.2023
Subjects
hybrid metrology
lab-to-fab
machine learning
materials characterization
Metrology
Process control
Semiconductor device measurement
Semiconductor devices
Sensitivity
Software algorithms
Three-dimensional displays
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Summary:We report on the challenges of process control for advanced semiconductor devices and comprehensive solutions to overcome them. The challenges arise in the environment of 3D structures and process complexity where pitch decreases and aspect ratio increases at advanced technology nodes. In this work we will summarize how various strategies, including the Lab to Fab conversion of new source technology, are being implemented through several cases. We will also outline the need for further improvement.
DOI:10.1109/EDTM55494.2023.10103045