MIDAS Wideband mmW Digital Tile

Raytheon Technologies teamed with Michigan State University and Teledyne Scientific present a zero-IF, mixed-signal, 32-channel millimeter-wave CMOS transceiver design developed under the DARPA/MTO MIDAS program. The architectural choices, design overview, and measured results from two generations o...

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Published in2022 IEEE International Symposium on Phased Array Systems & Technology (PAST) pp. 01 - 06
Main Authors McSpadden, James, Kushner, Lawrence J., Milne, Jason, Young, Richard, Maylone, Ray, Albrecht, John D., Papapolymerou, John, Hodek, Matthew S., Choe, Myung-Jun, Ihm, Jae-Yong, Lee, Kang-Jin, Hacker, Jonathan B.
Format Conference Proceeding
LanguageEnglish
Published IEEE 11.10.2022
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Summary:Raytheon Technologies teamed with Michigan State University and Teledyne Scientific present a zero-IF, mixed-signal, 32-channel millimeter-wave CMOS transceiver design developed under the DARPA/MTO MIDAS program. The architectural choices, design overview, and measured results from two generations of ASIC development are presented. As part of the MIDAS 3D T/R module, element-level digital beamforming provided by this ASIC will allow multiple simultaneous beams over a wide field of regard.
DOI:10.1109/PAST49659.2022.9975023