Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects

This paper describes the modeling approach and numerical results of MCM transmission lines formed by interwoven metallization patterns. The impedance of the signal traces is calculated based on quasistatic field approximations. The differences between conventional microstrip and interwoven transmiss...

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Published in1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) pp. 1379 - 1383
Main Authors Beker, B., Yee, I., Miracky, R.
Format Conference Proceeding Journal Article
LanguageEnglish
Published IEEE 1998
Subjects
Capacitance
Electromagnetic analysis
Impedance
Inductance
Integrated circuit interconnections
Metallization
Microstrip
Power transmission lines
Signal design
Wiring
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Summary:This paper describes the modeling approach and numerical results of MCM transmission lines formed by interwoven metallization patterns. The impedance of the signal traces is calculated based on quasistatic field approximations. The differences between conventional microstrip and interwoven transmission lines are pointed out and ample data are provided for the "weaved" line as a function of several geometrical parameters.
Bibliography:SourceType-Scholarly Journals-2
ObjectType-Feature-2
ObjectType-Conference Paper-1
content type line 23
SourceType-Conference Papers & Proceedings-1
ObjectType-Article-3
ISBN:9780780345263
0780345266
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.1998.678923