Application Specific Electronics Package - Electronics Manufacturing Technology of the Future

As transportation, commercial, industrial, and our homes undergo increased electrification, the need for highly reliable, smaller, and lower cost power electronics will increase. Application Specific Electronics Package (ASEP) is a next generation MID technology that enables the design and manufactu...

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Bibliographic Details
Published in2021 14th International Congress Molded Interconnect Devices (MID) pp. 1 - 6
Main Authors Han, Alan, Zaderej, Victor, Fitzpatrick, Richard
Format Conference Proceeding
LanguageEnglish
Published IEEE 08.02.2021
Subjects
Application Specific Electronics Package
ASEP
ASIC
automated
cad
connector
Connectors
design tools
ecad
heat dissipation
highly automated
inkjet
laser
Manufacturing
Manufacturing processes
mcad
Next generation networking
power
Power electronics
Reliability
simulation
smart connector
Solid-State relay
SSR
thermal
waste heat
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Summary:As transportation, commercial, industrial, and our homes undergo increased electrification, the need for highly reliable, smaller, and lower cost power electronics will increase. Application Specific Electronics Package (ASEP) is a next generation MID technology that enables the design and manufacture of power electronics that will meet these demands. Compared to traditional devices, ASEP smart connectors and power modules are often 40 to 80 percent smaller, 10 to 40 percent lighter, more reliable, more capable, and mate to standard connector interfaces, while remaining cost effective. Furthermore, the manufacturing process can be highly automated and uses 90 percent less water than common PCB manufacturing steps. In this paper, we will describe how ASEP was used to implement a next-generation line of Solid-State Relays (SSR). ASEP will lead the electronics industry into a new generation of electronics manufacturing.
DOI:10.1109/MID50463.2021.9361621