Reconfigurable Multifunctional Terahertz Holographic Metasurface using CMOS Chip Tiling

In this article, we exploit electromagnetic-circuit co-design approach to demonstrate a digitally reconfigurable metasurface at 0.3 THz. Realized on an industry standard 65-nm CMOS process, each metasurface CMOS chip consists 12×12 array of reconfigurable split-ring unit cells. Reconfiguration of ea...

Full description

Saved in:
Bibliographic Details
Published in2021 IEEE 19th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM) pp. 1 - 3
Main Authors Venkatesh, Suresh, Lu, Xuyang, Saeidi, Hooman, Sengupta, Kaushik
Format Conference Proceeding
LanguageEnglish
Published IEEE 08.08.2021
Subjects
Holography
Industries
Metasurfaces
Phase control
Phase modulation
Scalability
Switches
Online AccessGet full text

Cover

More Information
Summary:In this article, we exploit electromagnetic-circuit co-design approach to demonstrate a digitally reconfigurable metasurface at 0.3 THz. Realized on an industry standard 65-nm CMOS process, each metasurface CMOS chip consists 12×12 array of reconfigurable split-ring unit cells. Reconfiguration of each unit cell happens through EM-circuit co-designed CMOS transistor switches. Each unit-cell is individually addressable and controllable with on-chip high-speed digital back-end. Scalability of this approach is demonstrated by tiling such CMOS chips to form a larger aperture of 2×2 array. We experimentally demonstrate multi-functional applications namely, arbitrary amplitude and phase control, high-speed beam modulation with switching ON/OFF ratio of ~25 dB at a maximum clock speed of 5 GHz, beamforming capability of ± 30°, and spatial wavefront manipulation using binary-amplitude-only holography technique at 0.3 THz. Each metasurface consumes a total DC power of (240 µW) consumption and operates at 1.2V.
ISSN:2473-3555
DOI:10.1109/ANTEM51107.2021.9518737